Assignee

TAN KIA KUANG

MY·1 granted patent·8 citations·filing 2009–2009

Technology mixB23K1 F28D1 G06F1 H05K1 H10W1 Y10T1

Top patents by PatentIndex Score

1 record

0160US8159821B2Diffusion bonding circuit submount directly to vapor chamberTAN KIA KUANG·Filed 2009·Granted Apr 17, 2012·8 cites·38 claims

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