Assignee
TANAKA HIRONORI
JP·17 granted patents·2 pending applications·110 citations·filing 2006–2012
Top patents by PatentIndex Score
19 records- 0192US8291584B2Method of manufacturing a printed wiring board with built-in electronic componentTANAKA HIRONORI·Filed 2009·Granted Oct 23, 2012·24 cites·18 claims
- 0292US8115113B2Multilayer printed wiring board with a built-in capacitorTANAKA HIRONORI·Filed 2008·Granted Feb 14, 2012·18 cites·13 claims
- 0390US8237060B2Method for manufacturing multilayer printed wiring boardTANAKA HIRONORI·Filed 2009·Granted Aug 7, 2012·21 cites·18 claims
- 0487US8186046B2Method for manufacturing a multilayer printed wiring board for providing an electronic component thereinTANAKA HIRONORI·Filed 2008·Granted May 29, 2012·13 cites·16 claims
- 0584US8070907B2Jointing method for obtaining a joint structure formed of a plurality of partsTANAKA HIRONORI·Filed 2006·Granted Dec 6, 2011·5 cites·2 claims
- 0683US8462429B2Optical combiner and fiber laser device having the sameTANAKA HIRONORI·Filed 2012·Granted Jun 11, 2013·6 cites·9 claims
- 0780US9065939B2Printing management system using correspondence between user identification information of an information system and user identification information of a printing systemTANAKA HIRONORI·Filed 2012·Granted Jun 23, 2015·4 cites·10 claims
- 0876US9226399B2Wiring board with built-in capacitorTANAKA HIRONORI·Filed 2010·Granted Dec 29, 2015·3 cites·12 claims
- 0972US8455766B2Substrate with low-elasticity layer and low-thermal-expansion layerTANAKA HIRONORI·Filed 2008·Granted Jun 4, 2013·6 cites·9 claims
- 1072US8336205B2Method of manufacturing printed wiring board with built-in electronic componentTANAKA HIRONORI·Filed 2011·Granted Dec 25, 2012·3 cites·16 claims
- 1168US8575496B2Multilayer printed wiring board and method of manufacturing the sameTANAKA HIRONORI·Filed 2011·Granted Nov 5, 2013·1 cites·2 claims
- 1267US8613136B2Method of manufacturing printed wiring board with built-in electronic componentTANAKA HIRONORI·Filed 2009·Granted Dec 24, 2013·3 cites·16 claims
- 1364US8391015B2Capacitor-incorporated printed wiring board and electronic componentTANAKA HIRONORI·Filed 2009·Granted Mar 5, 2013·2 cites·10 claims
- 1463US8958090B2Image forming apparatus including an authentication processor, method, and computer readable mediumTANAKA HIRONORI·Filed 2012·Granted Feb 17, 2015·1 cites·6 claims
- 1557US8208267B2Printed wiring board with a built-in resistive elementTANAKA HIRONORI·Filed 2008·Granted Jun 26, 2012·0 cites·20 claims
- 1656US8471153B2Multilayer printed wiring board including a capacitor sectionTANAKA HIRONORI·Filed 2008·Granted Jun 25, 2013·0 cites·10 claims
- 1754US9101070B2Method for manufacturing multilayer printed wiring boardTANAKA HIRONORI·Filed 2011·Granted Aug 4, 2015·0 cites·15 claims
- 1848US2012170240A1Method of manufacturing a multilayer printed wiring board for providing an electronic component thereinTANAKA HIRONORI·Filed 2012·Application pending·0 cites
- 1943US2013083355A1Information processing system, data processing device, and information processing methodTANAKA HIRONORI·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →