Assignee
TANAZAWA HAKKOSHA KK
JP·9 granted patents·1 pending application·53 citations·filing 1988–2024
Top patents by PatentIndex Score
10 records- 0180US7745103B2Product with concave-convex pattern on its surface and method of forming the concave-convex patternTANAZAWA HAKKOSHA KK·Filed 2006·Granted Jun 29, 2010·2 cites·7 claims
- 0279US4919388APlastics shaping mold having patterned resin layerTANAZAWA HAKKOSHA KK·Filed 1988·Granted Apr 24, 1990·50 cites·11 claims
- 0378US12328814B2Printed wiring board and method for manufacturing printed wiring boardTANAZAWA HAKKOSHA KK·Filed 2024·Granted Jun 10, 2025·0 cites·2 claims
- 0463US11979982B2Printed wiring board and method for manufacturing printed wiring boardTANAZAWA HAKKOSHA KK·Filed 2020·Granted May 7, 2024·0 cites·3 claims
- 0558US11754617B2Printed circuit boardTANAZAWA HAKKOSHA KK·Filed 2020·Granted Sep 12, 2023·0 cites·12 claims
- 0654US10015876B2Printed board and method for manufacturing sameTANAZAWA HAKKOSHA KK·Filed 2015·Granted Jul 3, 2018·1 cites·4 claims
- 0753US12441030B2Resin molding die, method for manufacturing resin molding die, method for manufacturing resin molded article, and system for manufacturing resin molded articleTANAZAWA HAKKOSHA KK·Filed 2019·Granted Oct 14, 2025·0 cites·15 claims
- 0848US10124514B2Resin molding moldTANAZAWA HAKKOSHA KK·Filed 2016·Granted Nov 13, 2018·0 cites·2 claims
- 0941US2022369469A1Method of manufacturing printed wiring boardTANAZAWA HAKKOSHA KK·Filed 2020·Application pending·0 cites
- 1040US10773426B2Resin molding moldTANAZAWA HAKKOSHA KK·Filed 2016·Granted Sep 15, 2020·0 cites·1 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →