Assignee
TANG JIAMIAO
CN·2 granted patents·1 pending application·115 citations·filing 2006–2011
Top patents by PatentIndex Score
3 records- 0196US8084867B2Apparatus, system, and method for wireless connection in integrated circuit packagesTANG JIAMIAO·Filed 2006·Granted Dec 27, 2011·111 cites·14 claims
- 0281US8513108B2Apparatus, system, and method for wireless connection in integrated circuit packagesTANG JIAMIAO·Filed 2011·Granted Aug 20, 2013·4 cites·20 claims
- 0344US2009079064A1Methods of forming a thin tim coreless high density bump-less package and structures formed therebyTANG JIAMIAO·Filed 2007·Application pending·0 cites
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