Assignee
TAY CHENG SIEW
MY·3 granted patents·74 citations·filing 2006–2011
Top patents by PatentIndex Score
3 records- 0193US7642660B2Method and apparatus for reducing electrical interconnection fatigueTAY CHENG SIEW·Filed 2006·Granted Jan 5, 2010·71 cites·8 claims
- 0260US8079011B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2007·Granted Dec 13, 2011·3 cites·18 claims
- 0349US8533657B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2011·Granted Sep 10, 2013·0 cites·11 claims
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