Assignee
TAY LIONEL CHIEN HUI
SG·11 granted patents·1 pending application·99 citations·filing 2007–2012
Top patents by PatentIndex Score
12 records- 0198US8420447B2Integrated circuit packaging system with flipchip leadframe and method of manufacture thereofTAY LIONEL CHIEN HUI·Filed 2011·Granted Apr 16, 2013·80 cites·20 claims
- 0273US8174098B2Semiconductor device and method of providing a thermal dissipation path through RDL and conductive viaTAY LIONEL CHIEN HUI·Filed 2010·Granted May 8, 2012·4 cites·24 claims
- 0372US9202777B2Semiconductor package system with cut multiple lead padsTAY LIONEL CHIEN HUI·Filed 2008·Granted Dec 1, 2015·5 cites·6 claims
- 0470US8134227B2Stacked integrated circuit package system with conductive spacerTAY LIONEL CHIEN HUI·Filed 2007·Granted Mar 13, 2012·4 cites·10 claims
- 0568US8283250B2Semiconductor device and method of forming a conductive via-in-via structureTAY LIONEL CHIEN HUI·Filed 2008·Granted Oct 9, 2012·3 cites·25 claims
- 0666US8513801B2Integrated circuit package systemTAY LIONEL CHIEN HUI·Filed 2008·Granted Aug 20, 2013·3 cites·20 claims
- 0753US9252075B2Semiconductor device and method of forming a conductive via-in-via structureTAY LIONEL CHIEN HUI·Filed 2012·Granted Feb 2, 2016·0 cites·30 claims
- 0850US8921983B2Semiconductor package and method of forming similar structure for top and bottom bonding padsTAY LIONEL CHIEN HUI·Filed 2011·Granted Dec 30, 2014·0 cites·20 claims
- 0948US8203220B2Integrated circuit package system with multiple device units and method for manufacturing thereofTAY LIONEL CHIEN HUI·Filed 2010·Granted Jun 19, 2012·0 cites·18 claims
- 1045US8421198B2Integrated circuit package system with external interconnects at high densityTAY LIONEL CHIEN HUI·Filed 2007·Granted Apr 16, 2013·0 cites·9 claims
- 1144US8643157B2Integrated circuit package system having perimeter paddleTAY LIONEL CHIEN HUI·Filed 2007·Granted Feb 4, 2014·0 cites·6 claims
- 1243US2008308933A1Integrated circuit package system with different connection structuresTAY LIONEL CHIEN HUI·Filed 2007·Application pending·0 cites
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