Assignee
TELEPHUS INC
KR·4 granted patents·1 pending application·43 citations·filing 2000–2004
Top patents by PatentIndex Score
5 records- 0174US6930399B2High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the sameTELEPHUS INC·Filed 2001·Granted Aug 16, 2005·11 cites·7 claims
- 0272US7081675B2Multilayered anisotropic conductive adhesive for fine pitchTELEPHUS INC·Filed 2004·Granted Jul 25, 2006·24 cites·11 claims
- 0351US6458668B1Method for manufacturing hetero junction bipolar transistorTELEPHUS INC·Filed 2000·Granted Oct 1, 2002·8 cites·13 claims
- 0450US2006035036A1Anisotropic conductive adhesive for fine pitch and COG packaged LCD moduleTELEPHUS INC·Filed 2004·Application pending·0 cites
- 0529US6934430B2Optical module used in high frequency band optical communication systemTELEPHUS INC·Filed 2003·Granted Aug 23, 2005·0 cites·2 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →