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TELEPHUS INC
KR4 patents
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US7081675B2Jul 25, 2006
Multilayered anisotropic conductive adhesive for fine pitch
TELEPHUS INC24 citations85
US6930399B2Aug 16, 2005
High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
TELEPHUS INC11 citations72
US6458668B1Oct 1, 2002
Method for manufacturing hetero junction bipolar transistor
TELEPHUS INC8 citations66
US6934430B2Aug 23, 2005
Optical module used in high frequency band optical communication system
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