Assignee

TERDYNE INC

US·1 granted patent·3 citations·filing 2004–2004

Technology mixH05K1 Y10T1

Top patents by PatentIndex Score

1 record

0140US7388158B2Concentric spacer for reducing capacitive coupling in multilayer substrate assembliesTERDYNE INC·Filed 2004·Granted Jun 17, 2008·3 cites·10 claims

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