Assignee
TESSERA INC
US674 patents
Top patents by PatentIndex Score
US7901989B2Mar 8, 2011
Reconstituted wafer level stacking
TESSERA INC128 citations99
US6856235B2Feb 15, 2005
Methods for manufacturing resistors using a sacrificial layer
TESSERA INC129 citations99
US6856007B2Feb 15, 2005
High-frequency chip packages
TESSERA INC107 citations99
US6847101B2Jan 25, 2005
Microelectronic package having a compliant layer with bumped protrusions
TESSERA INC129 citations99
US6828668B2Dec 7, 2004
Flexible lead structures and methods of making same
TESSERA INC143 citations99
US6774317B2Aug 10, 2004
Connection components with posts
TESSERA INC93 citations99
US6765288B2Jul 20, 2004
Microelectronic adaptors, assemblies and methods
TESSERA INC156 citations99
US6699730B2Mar 2, 2004
Stacked microelectronic assembly and method therefor
TESSERA INC366 citations99
US6583444B2Jun 24, 2003
Semiconductor packages having light-sensitive chips
TESSERA INC270 citations99
US6492201B1Dec 10, 2002
Forming microelectronic connection components by electrophoretic deposition
TESSERA INC134 citations99
US6465893B1Oct 15, 2002
Stacked chip assembly
TESSERA INC152 citations99
US6437240B2Aug 20, 2002
Microelectronic connections with liquid conductive elements
TESSERA INC84 citations99
US6428328B2Aug 6, 2002
Method of making a connection to a microelectronic element
TESSERA INC151 citations99
US6392306B1May 21, 2002
Semiconductor chip assembly with anisotropic conductive adhesive connections
TESSERA INC83 citations99
US6372527B1Apr 16, 2002
Methods of making semiconductor chip assemblies
TESSERA INC86 citations99
US6365975B1Apr 2, 2002
Chip with internal signal routing in external element
TESSERA INC240 citations99
US6362520B2Mar 26, 2002
Microelectronic mounting with multiple lead deformation using restraining straps
TESSERA INC117 citations99
US6329224B1Dec 11, 2001
Encapsulation of microelectronic assemblies
TESSERA INC160 citations99
US6329605B1Dec 11, 2001
Components with conductive solder mask layers
TESSERA INC180 citations99
US6324754B1Dec 4, 2001
Method for fabricating microelectronic assemblies
TESSERA INC164 citations99
US6309915B1Oct 30, 2001
Semiconductor chip package with expander ring and method of making same
TESSERA INC130 citations99
US6294830B1Sep 25, 2001
Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer
TESSERA INC302 citations99
US6284563B1Sep 4, 2001
Method of making compliant microelectronic assemblies
TESSERA INC135 citations99
US6239384B1May 29, 2001
Microelectric lead structures with plural conductors
TESSERA INC234 citations99
US6228686B1May 8, 2001
Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions
TESSERA INC123 citations99
US6225688B1May 1, 2001
Stacked microelectronic assembly and method therefor
TESSERA INC472 citations99
US6211572B1Apr 3, 2001
Semiconductor chip package with fan-in leads
TESSERA INC282 citations99
US6208024B1Mar 27, 2001
Microelectronic mounting with multiple lead deformation using restraining straps
TESSERA INC118 citations99
US6200143B1Mar 13, 2001
Low insertion force connector for microelectronic elements
TESSERA INC181 citations99
US6194291B1Feb 27, 2001
Microelectronic assemblies with multiple leads
TESSERA INC182 citations99
US6177636B1Jan 23, 2001
Connection components with posts
TESSERA INC305 citations99
US6133072AOct 17, 2000
Microelectronic connector with planar elastomer sockets
TESSERA INC233 citations99
US6130116AOct 10, 2000
Method of encapsulating a microelectronic assembly utilizing a barrier
TESSERA INC148 citations99
US6127724AOct 3, 2000
Packaged microelectronic elements with enhanced thermal conduction
TESSERA INC141 citations99
US6117694ASep 12, 2000
Flexible lead structures and methods of making same
TESSERA INC219 citations99
US6093584AJul 25, 2000
Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
TESSERA INC157 citations99
US6086386AJul 11, 2000
Flexible connectors for microelectronic elements
TESSERA INC248 citations99
US6075289AJun 13, 2000
Thermally enhanced packaged semiconductor assemblies
TESSERA INC212 citations99
US6046076AApr 4, 2000
Vacuum dispense method for dispensing an encapsulant and machine therefor
TESSERA INC143 citations99
US6030856AFeb 29, 2000
Bondable compliant pads for packaging of a semiconductor chip and method therefor
TESSERA INC127 citations99
US6012224AJan 11, 2000
Method of forming compliant microelectronic mounting device
TESSERA INC157 citations99
US6001671ADec 14, 1999
Methods for manufacturing a semiconductor package having a sacrificial layer
TESSERA INC712 citations99
US5989936ANov 23, 1999
Microelectronic assembly fabrication with terminal formation from a conductive layer
TESSERA INC215 citations99
US5980270ANov 9, 1999
Soldering with resilient contacts
TESSERA INC249 citations99
US5977618ANov 2, 1999
Semiconductor connection components and methods with releasable lead support
TESSERA INC132 citations99
US5971253AOct 26, 1999
Microelectronic component mounting with deformable shell terminals
TESSERA INC196 citations99
US5951305ASep 14, 1999
Lidless socket and method of making same
TESSERA INC134 citations99
US5950304ASep 14, 1999
Methods of making semiconductor chip assemblies
TESSERA INC129 citations99
US5929517AJul 27, 1999
Compliant integrated circuit package and method of fabricating the same
TESSERA INC185 citations99
US5885849AMar 23, 1999
Methods of making microelectronic assemblies
TESSERA INC131 citations99
Showing the top 50 of 674 patents by PatentIndex Score.