Assignee
THERMAGON INC
US6 patents
Top patents by PatentIndex Score
US6372997B1Apr 16, 2002
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
THERMAGON INC95 citations96
US6761928B2Jul 13, 2004
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
THERMAGON INC38 citations94
US7369411B2May 6, 2008
Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
THERMAGON INC51 citations92
US6617517B2Sep 9, 2003
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
THERMAGON INC32 citations92
US6849941B1Feb 1, 2005
Heat sink and heat spreader assembly
THERMAGON INC23 citations90
US7078109B2Jul 18, 2006
Heat spreading thermal interface structure
THERMAGON INC48 citations89