Assignee

TIAN YONGLAI

US2 patents

Top patents by PatentIndex Score

US8207478B2Jun 26, 2012

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

TIAN YONGLAI7 citations76

US7569800B2Aug 4, 2009

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

TIAN YONGLAI8 citations76