Assignee
TOH CHIN HOCK
SG·8 granted patents·114 citations·filing 2008–2013
Top patents by PatentIndex Score
8 records- 0197US8426246B2Vented die and packageTOH CHIN HOCK·Filed 2012·Granted Apr 23, 2013·50 cites·21 claims
- 0292US8115292B2Interposer for semiconductor packageTOH CHIN HOCK·Filed 2009·Granted Feb 14, 2012·37 cites·23 claims
- 0386US8143719B2Vented die and packageTOH CHIN HOCK·Filed 2008·Granted Mar 27, 2012·13 cites·29 claims
- 0477US8647924B2Semiconductor package and method of packaging semiconductor devicesTOH CHIN HOCK·Filed 2010·Granted Feb 11, 2014·8 cites·23 claims
- 0567US8703534B2Semiconductor packages and methods of packaging semiconductor devicesTOH CHIN HOCK·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 0665US9202801B2Thin substrate and mold compound handling using an electrostatic-chucking carrierTOH CHIN HOCK·Filed 2013·Granted Dec 1, 2015·2 cites·16 claims
- 0765US8772921B2Interposer for semiconductor packageTOH CHIN HOCK·Filed 2012·Granted Jul 8, 2014·2 cites·20 claims
- 0840US9219044B2Patterned photoresist to attach a carrier wafer to a silicon device waferTOH CHIN HOCK·Filed 2013·Granted Dec 22, 2015·0 cites·16 claims
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