Assignee
TOKAI CARBON KOREA CO LTD
KR·20 granted patents·12 pending applications·1 citations·filing 2007–2025
Top patents by PatentIndex Score
32 records- 0168US11697620B2Method for preparing silicon-carbide-silicon-nitride composite material, and silicon-carbide- silicon-nitride composite material according to sameTOKAI CARBON KOREA CO LTD·Filed 2020·Granted Jul 11, 2023·0 cites·2 claims
- 0266US12371324B2Carbon-silicon composite and preparation method thereforTOKAI CARBON KOREA CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·13 claims
- 0366US11976353B2Tantalum carbide-coated carbon material and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2021·Granted May 7, 2024·0 cites·10 claims
- 0463US11697874B2Tantalum carbide coated carbon materialTOKAI CARBON KOREA CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 0563US2009191405A1Metal coated with ceramic and method of manufacturing the sameTOKAI CARBON KOREA CO LTD·Filed 2008·Application pending·0 cites
- 0662US2010089499A1Method of manufacturing metal coated with ceramicTOKAI CARBON KOREA CO LTD·Filed 2009·Application pending·0 cites
- 0761US11780732B2Carbonated tantalum coating materialTOKAI CARBON KOREA CO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·3 claims
- 0861US11279620B2Carbon material coated with tantalum carbideTOKAI CARBON KOREA CO LTD·Filed 2017·Granted Mar 22, 2022·1 cites·11 claims
- 0959US2025188603A1Component for fabricating a semiconductor, having plurality of layers having different transmittances, and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2025·Application pending·0 cites
- 1056US2026011599A1Component for semiconductor manufacturing apparatus, and manufacturing method thereforTOKAI CARBON KOREA CO LTD·Filed 2022·Application pending·0 cites
- 1153US12062568B2SiC edge ringTOKAI CARBON KOREA CO LTD·Filed 2020·Granted Aug 13, 2024·0 cites·16 claims
- 1251US8026329B2Polycarbosilane and method of producing the sameTOKAI CARBON KOREA CO LTD·Filed 2009·Granted Sep 27, 2011·0 cites·4 claims
- 1350US2022069304A1Anode active material, preparation method therefor, and lithium secondary battery comprising sameTOKAI CARBON KOREA CO LTD·Filed 2019·Application pending·0 cites
- 1449US11268189B2Method of manufacturing tantalum carbide coating layer using chemical vapor deposition and tantalum carbide manufactured using the sameTOKAI CARBON KOREA CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·4 claims
- 1549US11180855B2Semiconductor manufacturing component comprising deposition layer covering interlayer boundary and manufacturing method thereofTOKAI CARBON KOREA CO LTD·Filed 2017·Granted Nov 23, 2021·0 cites·11 claims
- 1649US11091833B2Carbon material having coating layer comprising TaC, and method for producing said carbon materialTOKAI CARBON KOREA CO LTD·Filed 2018·Granted Aug 17, 2021·0 cites·16 claims
- 1748US11367612B2Method and apparatus for manufacturing semiconductor manufacturing parts by using jigTOKAI CARBON KOREA CO LTD·Filed 2017·Granted Jun 21, 2022·0 cites·7 claims
- 1847US10883170B2Carbon material having coating layer comprising tac, and method for producing said carbon materialTOKAI CARBON KOREA CO LTD·Filed 2018·Granted Jan 5, 2021·0 cites·15 claims
- 1947US2023042832A1Sic structure formed by cvd methodTOKAI CARBON KOREA CO LTD·Filed 2020·Application pending·0 cites
- 2046US11658060B2SiC material and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2020·Granted May 23, 2023·0 cites·13 claims
- 2146US11591227B2SiC material and SiC composite materialTOKAI CARBON KOREA CO LTD·Filed 2017·Granted Feb 28, 2023·0 cites·5 claims
- 2246US10586687B2Method and apparatus for reproducing component of semiconductor manufacturing apparatus, and reproduced componentTOKAI CARBON KOREA CO LTD·Filed 2016·Granted Mar 10, 2020·0 cites·16 claims
- 2345US2008118758A1Metal coated with ceramic and method of manufacturing the sameTOKAI CARBON KOREA CO LTD·Filed 2007·Application pending·0 cites
- 2442US11694893B2Semiconductor manufacturing parts comprising SiC deposition layer, and manufacturing method thereforTOKAI CARBON KOREA CO LTD·Filed 2017·Granted Jul 4, 2023·0 cites·12 claims
- 2541US2019206686A1Component for fabricating sic semiconductor, having plurality of layers having different transmittances, and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2017·Application pending·0 cites
- 2638US11072532B2Method for manufacturing activated carbon for electrode materialTOKAI CARBON KOREA CO LTD·Filed 2018·Granted Jul 27, 2021·0 cites·12 claims
- 2734US11390566B2Bonded ceramic and manufacturing method thereforTOKAI CARBON KOREA CO LTD·Filed 2018·Granted Jul 19, 2022·0 cites·8 claims
- 2834US9956589B2Method for repairing semiconductor processing componentsTOKAI CARBON KOREA CO LTD·Filed 2015·Granted May 1, 2018·0 cites·9 claims
- 2932US2020165138A1Method for manufacturing activated carbon for electrode materialTOKAI CARBON KOREA CO LTD·Filed 2018·Application pending·0 cites
- 3031US2021179435A1Activated carbon and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2018·Application pending·0 cites
- 3129US2020043757A1Part for manufacturing semiconductor, part for manufacturing semiconductor containing composite coating layer, and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2017·Application pending·0 cites
- 3225US2020317586A1Bonded ceramic having channel through which fluid can flow, and method for manufacturing sameTOKAI CARBON KOREA CO LTD·Filed 2018·Application pending·0 cites
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