Assignee
TOKYO TUNGSTEN KK
JP·9 granted patents·182 citations·filing 1993–2003
Top patents by PatentIndex Score
9 records- 0177US5493153APlastic-packaged semiconductor device having a heat sink matched with a plastic packageTOKYO TUNGSTEN KK·Filed 1993·Granted Feb 20, 1996·59 cites·38 claims
- 0273US6475429B2Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Nov 5, 2002·19 cites·19 claims
- 0371US5508118ARotary anode for x-ray tubeTOKYO TUNGSTEN KK·Filed 1993·Granted Apr 16, 1996·29 cites·4 claims
- 0469US6595821B2Rotary anode for X-ray tube comprising an Mo-containing layer and a W-containing layer laminated to each other and method of producing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Jul 22, 2003·7 cites·6 claims
- 0568US6271585B1Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 1998·Granted Aug 7, 2001·32 cites·27 claims
- 0655US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 0747US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
- 0846US5352489AMethod for manufacturing a rotary anode for X-ray tubeTOKYO TUNGSTEN KK·Filed 1993·Granted Oct 4, 1994·7 cites·1 claims
- 0942US5928976AComposite carbide powder used for cemented carbide and method of producing the sameTOKYO TUNGSTEN KK·Filed 1997·Granted Jul 27, 1999·10 cites·15 claims
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