Assignee
TOMURA YOSHIHIRO
JP·4 granted patents·19 citations·filing 2007–2009
Top patents by PatentIndex Score
4 records- 0173US8110933B2Semiconductor device mounted structure and semiconductor device mounted methodTOMURA YOSHIHIRO·Filed 2007·Granted Feb 7, 2012·6 cites·7 claims
- 0272US8283570B2Semiconductor assembly and multilayer wiring boardTOMURA YOSHIHIRO·Filed 2008·Granted Oct 9, 2012·5 cites·12 claims
- 0368US8895359B2Semiconductor device, flip-chip mounting method and flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Nov 25, 2014·4 cites·2 claims
- 0466US8163599B2Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Apr 24, 2012·4 cites·5 claims
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