Assignee
TOWA CORP
JP64 patents
Top patents by PatentIndex Score
US5834035ANov 10, 1998
Method of and apparatus for molding resin to seal electronic parts
TOWA CORP91 citations95
US5603879AFeb 18, 1997
Method of molding resin to seal electronic parts using two evacuation steps
TOWA CORP48 citations95
US5435953AJul 25, 1995
Method of molding resin for sealing an electronic device
TOWA CORP76 citations95
US6630374B2Oct 7, 2003
Resin sealing method and resin sealing apparatus
TOWA CORP24 citations93
US7682853B2Mar 23, 2010
Transparent member, optical device using transparent member and method of manufacturing optical device
TOWA CORP23 citations92
US6977188B2Dec 20, 2005
Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
TOWA CORP36 citations92
US6476507B1Nov 5, 2002
Resin sealing method and resin sealing apparatus
TOWA CORP37 citations92
US6358776B1Mar 19, 2002
Method of fabricating an electronic component and apparatus used therefor
TOWA CORP42 citations92
US5874324AFeb 23, 1999
Method of sealing electronic component with molded resin
TOWA CORP30 citations92
US5507633AApr 16, 1996
Resin molding apparatus for sealing an electronic device
TOWA CORP36 citations92
US6346433B1Feb 12, 2002
Method of coating semiconductor wafer with resin and mold used therefor
TOWA CORP27 citations91
US6773247B1Aug 10, 2004
Die used for resin-sealing and molding an electronic component
TOWA CORP31 citations90
US5753538AMay 19, 1998
Method of sealing electronic parts with molded resin and mold employed therefor
TOWA CORP42 citations89
US6165232ADec 26, 2000
Method and apparatus for securely holding a substrate during dicing
TOWA CORP46 citations86
US6919223B2Jul 19, 2005
Method of manufacturing semiconductor resin molding and resin member employed therefor
TOWA CORP13 citations84
US5783220AJul 21, 1998
Resin sealing and molding apparatus for sealing electronic parts
TOWA CORP19 citations84
US5363777ANov 15, 1994
Waste heat treatment apparatus
TOWA CORP38 citations83
US7207868B2Apr 24, 2007
Cutting apparatus
TOWA CORP15 citations80
US7861624B2Jan 4, 2011
Method of and apparatus for working structure
TOWA CORP12 citations76
US6929977B2Aug 16, 2005
Method of introducing resin for electronic component and apparatus used therefor
TOWA CORP8 citations73
US6736703B2May 18, 2004
Cutting apparatus and cutting method
TOWA CORP8 citations73
US6438826B2Aug 27, 2002
Electronic component, method of sealing electronic component with resin, and apparatus therefor
TOWA CORP13 citations72
US5750154AMay 12, 1998
Resin sealing/molding apparatus for electronic parts
TOWA CORP7 citations72
US7811491B2Oct 12, 2010
Method for manufacturing optical electronic component
TOWA CORP6 citations71
US6436331B1Aug 20, 2002
Method of resin sealing a gap between a semiconductor chip and a substrate
TOWA CORP13 citations71
US6007316ADec 28, 1999
Apparatus for molding resin to seal electronic parts
TOWA CORP10 citations69
US5750059AMay 12, 1998
Method of molding resin to seal electronic parts
TOWA CORP15 citations69
US9728426B2Aug 8, 2017
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
TOWA CORP2 citations67
US6851355B2Feb 8, 2005
Pressing method, pressing mechanism and resin molding device
TOWA CORP9 citations66
US10170346B2Jan 1, 2019
Resin sealing apparatus and resin sealing method
TOWA CORP2 citations62
US7618573B2Nov 17, 2009
Resin sealing method for electronic part and mold used for the method
TOWA CORP2 citations62
US6712674B2Mar 30, 2004
Polishing apparatus and polishing method
TOWA CORP4 citations62
US11712823B2Aug 1, 2023
Molding die for compression molding with resin leakage prevention member
TOWA CORP0 citations61
US7901797B2Mar 8, 2011
Low-adhesion material, resin molding die, and soil resistant material
TOWA CORP2 citations61
US7732037B2Jun 8, 2010
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
TOWA CORP2 citations61
US7985357B2Jul 26, 2011
Method of resin-sealing and molding an optical device
TOWA CORP2 citations60
US7614293B2Nov 10, 2009
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
TOWA CORP2 citations60
US7784764B2Aug 31, 2010
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
TOWA CORP2 citations59
US7407146B2Aug 5, 2008
Composite material and resin mold
TOWA CORP3 citations58
US11981059B2May 14, 2024
Conveying apparatus and resin molding apparatus
TOWA CORP0 citations57
US11938660B2Mar 26, 2024
Mold die, resin molding apparatus, and method for producing resin molded product
TOWA CORP1 citations57
US6594889B1Jul 22, 2003
Method for processing leadframe
TOWA CORP2 citations57
US11833722B2Dec 5, 2023
Resin molding apparatus and method of manufacturing resin molded product
TOWA CORP0 citations56
US6258628B1Jul 10, 2001
Method and apparatus for processing resin sealed lead frame
TOWA CORP3 citations56
US12564986B2Mar 3, 2026
Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded product
TOWA CORP0 citations51
USD956833SJul 5, 2022
Plunger unit
TOWA CORP0 citations49
US7439101B2Oct 21, 2008
Resin encapsulation molding method for semiconductor device
TOWA CORP5 citations49
US10792880B2Oct 6, 2020
Tableting punch or die and tableting machine including the same
TOWA CORP0 citations48
US12508754B2Dec 30, 2025
Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product
TOWA CORP0 citations47
US12415302B2Sep 16, 2025
Conveying apparatus, resin molding apparatus, conveying method, and resin molded product manufacturing method
TOWA CORP0 citations47
Showing the top 50 of 64 patents by PatentIndex Score.