Assignee
TSAI CHUNG-JEN
TW·3 granted patents·13 citations·filing 2009–2009
Top patents by PatentIndex Score
3 records- 0176US8300420B2Circuit substrate for mounting electronic component and circuit substrate assembly having sameTSAI CHUNG-JEN·Filed 2009·Granted Oct 30, 2012·9 cites·20 claims
- 0265US8067696B2Printed circuit board and method for manufacturing sameTSAI CHUNG-JEN·Filed 2009·Granted Nov 29, 2011·3 cites·12 claims
- 0357US8227175B2Method for smoothing printed circuit boardsTSAI CHUNG-JEN·Filed 2009·Granted Jul 24, 2012·1 cites·7 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →