Assignee
TSAI HAO-YI
TW·4 granted patents·1 pending application·39 citations·filing 2006–2012
Top patents by PatentIndex Score
5 records- 0195US8405211B2Bump pad structureTSAI HAO-YI·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 0284US9000876B2Inductor for post passivation interconnectTSAI HAO-YI·Filed 2012·Granted Apr 7, 2015·6 cites·16 claims
- 0381US9601443B2Test structure for seal ring quality monitorTSAI HAO-YI·Filed 2007·Granted Mar 21, 2017·8 cites·20 claims
- 0465US8519512B2Test line placement to improve die sawing qualityTSAI HAO-YI·Filed 2006·Granted Aug 27, 2013·2 cites·18 claims
- 0543US2008246031A1PCM pad design for peeling preventionTSAI HAO-YI·Filed 2007·Application pending·0 cites
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