Assignee
TSAI HSIN-YI
TW·3 granted patents·10 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0174US8404581B2Method of forming an interconnect of a semiconductor deviceTSAI HSIN-YI·Filed 2009·Granted Mar 26, 2013·5 cites·16 claims
- 0269US9496217B2Method and apparatus of forming a viaTSAI HSIN-YI·Filed 2009·Granted Nov 15, 2016·5 cites·20 claims
- 0341US8643836B1Inspection method for inspecting defects of wafer surfaceTSAI HSIN-YI·Filed 2012·Granted Feb 4, 2014·0 cites·6 claims
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