Assignee

TSAI PEI-CHUN

TW·1 granted patent·44 citations·filing 2011–2011

Technology mixH01L1 H10W1

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0194US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims

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