Assignee
TSAI SHUANG-JI
TW·6 granted patents·39 citations·filing 2011–2012
Top patents by PatentIndex Score
6 records- 0193US8435824B2Backside illumination sensor having a bonding pad structure and method of making the sameTSAI SHUANG-JI·Filed 2011·Granted May 7, 2013·18 cites·20 claims
- 0290US9165970B2Back side illuminated image sensor having isolated bonding padsTSAI SHUANG-JI·Filed 2011·Granted Oct 20, 2015·8 cites·17 claims
- 0385US9455288B2Image sensor structure to reduce cross-talk and improve quantum efficiencyTSAI SHUANG-JI·Filed 2012·Granted Sep 27, 2016·4 cites·19 claims
- 0480US8946849B2BSI image sensor chips with separated color filters and methods for forming the sameTSAI SHUANG-JI·Filed 2012·Granted Feb 3, 2015·2 cites·20 claims
- 0578US8710612B2Semiconductor device having a bonding pad and shield structure of different thicknessTSAI SHUANG-JI·Filed 2011·Granted Apr 29, 2014·4 cites·12 claims
- 0671US8664736B2Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the sameTSAI SHUANG-JI·Filed 2011·Granted Mar 4, 2014·3 cites·15 claims
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