Assignee

TSAI YI HENG

TW·2 granted patents·104 citations·filing 2011–2012

Technology mixB81B2 B81C2 G01P1 H02N1 Y10T1

Top patents by PatentIndex Score

2 records

0197US9085456B2Support structure for TSV in MEMS structureTSAI YI HENG·Filed 2012·Granted Jul 21, 2015·53 cites·20 claims
0297US9065358B2MEMS structure and method of forming sameTSAI YI HENG·Filed 2011·Granted Jun 23, 2015·51 cites·14 claims

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