Assignee
TSAI YU-PIN
TW·1 granted patent·3 pending applications·0 citations·filing 2005–2011
Top patents by PatentIndex Score
4 records- 0139US2008200037A1Method of thinning a waferTSAI YU-PIN·Filed 2007·Application pending·0 cites
- 0235US2010001416A1Wafer laser-marking method and die fabricated using the sameTSAI YU-PIN·Filed 2009·Application pending·0 cites
- 0333US2006256222A1CIS Package and Method ThereofTSAI YU-PIN·Filed 2005·Application pending·0 cites
- 0428US8728915B2Wafer laser-making method and die fabricated using the sameTSAI YU-PIN·Filed 2011·Granted May 20, 2014·0 cites·11 claims
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