Assignee
TSAO PEI-HAW
TW·2 granted patents·3 pending applications·0 citations·filing 2004–2011
Top patents by PatentIndex Score
5 records- 0149US8685834B2Fabrication method of package structure with simplified encapsulation structure and simplified wiringTSAO PEI-HAW·Filed 2009·Granted Apr 1, 2014·0 cites·10 claims
- 0239US8217520B2System-in-package packaging for minimizing bond wire contamination and yield lossTSAO PEI-HAW·Filed 2010·Granted Jul 10, 2012·0 cites·5 claims
- 0334US2012306067A1Thermally Enhanced Integrated Circuit PackageTSAO PEI-HAW·Filed 2011·Application pending·0 cites
- 0434US2006065958A1Three dimensional package and packaging method for integrated circuitsTSAO PEI-HAW·Filed 2004·Application pending·0 cites
- 0530US2008003803A1Semiconductor package substrate for flip chip packagingTSAO PEI-HAW·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →