Assignee
TSE CO LTD
KR·24 granted patents·13 pending applications·13 citations·filing 2018–2025
Top patents by PatentIndex Score
37 records- 0193US11609244B2Test apparatus for semiconductor packageTSE CO LTD·Filed 2021·Granted Mar 21, 2023·3 cites·15 claims
- 0292US11506705B2Test socket and test apparatus having the sameTSE CO LTD·Filed 2021·Granted Nov 22, 2022·3 cites·20 claims
- 0387US11131707B1Test socket and test apparatus having the same, manufacturing method for the test socketTSE CO LTD·Filed 2021·Granted Sep 28, 2021·2 cites·13 claims
- 0481US11199577B2Test socket and test apparatus having the same, manufacturing method for the test socketTSE CO LTD·Filed 2021·Granted Dec 14, 2021·1 cites·22 claims
- 0580US11573248B2Test socket and test apparatus having the sameTSE CO LTD·Filed 2021·Granted Feb 7, 2023·1 cites·10 claims
- 0679US10718809B1History management pad of semiconductor test socket, manufacturing method thereof, and semiconductor test device including history management padTSE CO LTD·Filed 2018·Granted Jul 21, 2020·3 cites·15 claims
- 0773US2026079178A1Chip socket assembly for semiconductor chip testing and semiconductor chip testing apparatus including the sameTSE CO LTD·Filed 2025·Application pending·0 cites
- 0873US2026056228A1Signal trsansmission connectorTSE CO LTD·Filed 2025·Application pending·0 cites
- 0968US2026056231A1Pogo pin and test socket including the sameTSE CO LTD·Filed 2025·Application pending·0 cites
- 1064US12405869B2Test apparatus for testing a mobile APTSE CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·9 claims
- 1163US12210038B2Method of manufacturing a probe tip and a probe tip manufactured by the sameTSE CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1262US11994554B2Test apparatus for semiconductor packageTSE CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1361US2025027972A1Data signal transmission connector and manufacturing method for the sameTSE CO LTD·Filed 2024·Application pending·0 cites
- 1460US2025334632A1Test headTSE CO LTD·Filed 2025·Application pending·0 cites
- 1560US2025334611A1Probing headTSE CO LTD·Filed 2025·Application pending·0 cites
- 1659US11940484B2Test apparatus for semiconductor packageTSE CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·16 claims
- 1758US12584960B2Test apparatus for semiconductor packageTSE CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·10 claims
- 1858US12429519B2Test apparatus for image sensor packageTSE CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·11 claims
- 1957US2025237674A1Signal trsansmission connectorTSE CO LTD·Filed 2025·Application pending·0 cites
- 2055US12313678B2Test apparatus for a semiconductor packageTSE CO LTD·Filed 2023·Granted May 27, 2025·0 cites·7 claims
- 2154US12169219B2Apparatus for testing a semiconductor packageTSE CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·8 claims
- 2253US2024094251A1Test socketTSE CO LTD·Filed 2023·Application pending·0 cites
- 2352US12461144B2Rubber socket with built-in componentTSE CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·8 claims
- 2448US12555966B2Data signal transmission connectorTSE CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·8 claims
- 2547US11233352B2Electro-conductive part protecting member for signal transmission connectorTSE CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·7 claims
- 2646US12584944B2Test socketTSE CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·10 claims
- 2745US11763959B2Electroconductive particles and signal-transmitting connector having sameTSE CO LTD·Filed 2019·Granted Sep 19, 2023·0 cites·4 claims
- 2845US2025172586A1Modular test socketTSE CO LTD·Filed 2024·Application pending·0 cites
- 2943US12169211B2Vertical probe pin and a probe card having sameTSE CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·10 claims
- 3041US12598707B2Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the sameTSE CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 3141US2022386479A1Batch joining type multi-layer printed circuit board and manufacturing method of the sameTSE CO LTD·Filed 2021·Application pending·0 cites
- 3240US2024369597A1Test socketTSE CO LTD·Filed 2024·Application pending·0 cites
- 3339US12416668B2Apparatus for testing semiconductor packageTSE CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·10 claims
- 3439US12108544B2Multi-layer printed circuit board made of different materials and manufacturing method thereofTSE CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·7 claims
- 3533US2025290954A1Probe head with adjustable protrusion length of probeTSE CO LTD·Filed 2022·Application pending·0 cites
- 3633US2025277814A1Probe head with adjustable protrusion length of probeTSE CO LTD·Filed 2022·Application pending·0 cites
- 3730US12000863B2Probe pin having gripping structureTSE CO LTD·Filed 2020·Granted Jun 4, 2024·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when TSE CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →