Assignee

TSENG MING-HONG

TW2 patents

Top patents by PatentIndex Score

US8390125B2Mar 5, 2013

Through-silicon via formed with a post passivation interconnect structure

TSENG MING-HONG39 citations87

US8097953B2Jan 17, 2012

Three-dimensional integrated circuit stacking-joint interface structure

TSENG MING-HONG8 citations82