Assignee
TSUI ANTHONY C
US·1 granted patent·2 pending applications·3 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0168US8106493B2Semiconductor device package having features formed by stampingTSUI ANTHONY C·Filed 2010·Granted Jan 31, 2012·3 cites·20 claims
- 0234US2012181677A1Semiconductor device package with two component lead frameTSUI ANTHONY C·Filed 2012·Application pending·0 cites
- 0334US2012181676A1Power semiconductor device packagingTSUI ANTHONY C·Filed 2012·Application pending·0 cites
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