Assignee

TSUI YAT KIT

HK·2 granted patents·7 citations·filing 2010–2012

Technology mixH10W2 H01L1 H10D1 H10F1

Top patents by PatentIndex Score

2 records

0178US8232626B2Via and method of via forming and method of via fillingTSUI YAT KIT·Filed 2010·Granted Jul 31, 2012·7 cites·22 claims
0235US9117715B2Wafer-level device packagingTSUI YAT KIT·Filed 2012·Granted Aug 25, 2015·0 cites·12 claims

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