Assignee
TSURUME TAKUYA
JP·12 granted patents·43 citations·filing 2005–2012
Top patents by PatentIndex Score
12 records- 0189US8557699B2Semiconductor device and manufacturing method thereofTSURUME TAKUYA·Filed 2010·Granted Oct 15, 2013·6 cites·10 claims
- 0287US8749063B2Semiconductor device and method for manufacturing the sameTSURUME TAKUYA·Filed 2006·Granted Jun 10, 2014·10 cites·22 claims
- 0381US8598574B2Light-emitting deviceTSURUME TAKUYA·Filed 2012·Granted Dec 3, 2013·4 cites·22 claims
- 0479US8426293B2IC chip and its manufacturing methodTSURUME TAKUYA·Filed 2005·Granted Apr 23, 2013·6 cites·11 claims
- 0578US8101990B2Semiconductor deviceTSURUME TAKUYA·Filed 2006·Granted Jan 24, 2012·8 cites·18 claims
- 0674US8698262B2Wireless chip and manufacturing method of the sameTSURUME TAKUYA·Filed 2005·Granted Apr 15, 2014·6 cites·14 claims
- 0773US9040998B2Light-emitting deviceTSURUME TAKUYA·Filed 2012·Granted May 26, 2015·2 cites·16 claims
- 0863US8058152B2Method for manufacturing integrated circuitTSURUME TAKUYA·Filed 2010·Granted Nov 15, 2011·1 cites·22 claims
- 0950US8822272B2Semiconductor device, manufacturing method thereof, and measuring method thereofTSURUME TAKUYA·Filed 2006·Granted Sep 2, 2014·0 cites·12 claims
- 1049US8878223B2Light emitting device and method for manufacturing thereofTSURUME TAKUYA·Filed 2012·Granted Nov 4, 2014·0 cites·24 claims
- 1149US8617995B2Manufacturing method of semiconductor deviceTSURUME TAKUYA·Filed 2011·Granted Dec 31, 2013·0 cites·18 claims
- 1249US8168512B2Manufacturing method of semiconductor deviceTSURUME TAKUYA·Filed 2010·Granted May 1, 2012·0 cites·20 claims
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