Assignee
TU HSIU-WEN
TW·8 granted patents·41 citations·filing 2009–2011
Top patents by PatentIndex Score
8 records- 0189US8440488B2Manufacturing method and structure for wafer level image sensor module with fixed focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·8 cites·4 claims
- 0282US8563350B2Wafer level image sensor packaging structure and manufacturing method for the sameTU HSIU-WEN·Filed 2010·Granted Oct 22, 2013·7 cites·16 claims
- 0379US8441086B2Image sensor packaging structure with predetermined focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·6 cites·4 claims
- 0479US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 0573US8928104B2Image sensor packaging structure with black encapsulantTU HSIU-WEN·Filed 2010·Granted Jan 6, 2015·4 cites·12 claims
- 0670US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 0767US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 0845US8828777B2Wafer level image sensor packaging structure and manufacturing method of the sameTU HSIU-WEN·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
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