Individual holder
UEHLING TRENT S
US·10 granted patents·1 pending application·20 citations·filing 2011–2014
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
11 records- 0186US9466544B2Semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic deviceUEHLING TRENT S·Filed 2013·Granted Oct 11, 2016·7 cites·11 claims
- 0277US8314026B2Anchored conductive via and method for formingUEHLING TRENT S·Filed 2011·Granted Nov 20, 2012·5 cites·20 claims
- 0372US8766453B2Packaged integrated circuit having large solder pads and method for formingUEHLING TRENT S·Filed 2012·Granted Jul 1, 2014·3 cites·20 claims
- 0467US8704370B2Semiconductor package structure having an air gap and method for formingUEHLING TRENT S·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 0563US8895409B2Semiconductor wafer plating bus and method for formingUEHLING TRENT S·Filed 2013·Granted Nov 25, 2014·1 cites·8 claims
- 0662US9324667B2Semiconductor devices with compliant interconnectsUEHLING TRENT S·Filed 2012·Granted Apr 26, 2016·2 cites·11 claims
- 0750US8519513B2Semiconductor wafer plating busUEHLING TRENT S·Filed 2012·Granted Aug 27, 2013·0 cites·12 claims
- 0846US9385064B2Heat sink having a through-openingUEHLING TRENT S·Filed 2014·Granted Jul 5, 2016·0 cites·20 claims
- 0945US9659831B2Methods and structures for detecting low strength in an interlayer dielectric structureUEHLING TRENT S·Filed 2014·Granted May 23, 2017·0 cites·20 claims
- 1044US8994190B2Low-temperature flip chip die attachUEHLING TRENT S·Filed 2012·Granted Mar 31, 2015·0 cites·15 claims
- 1140US2013299947A1Passivated test structures to enable saw singulation of waferUEHLING TRENT S·Filed 2012·Application pending·0 cites
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