Assignee
UEMATSU HIROYUKI
JP·2 granted patents·3 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0171US8822837B2Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrateUEMATSU HIROYUKI·Filed 2011·Granted Sep 2, 2014·3 cites·10 claims
- 0242US8591750B2Multilayer wiring board and manufacturing method thereofUEMATSU HIROYUKI·Filed 2010·Granted Nov 26, 2013·0 cites·3 claims
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