Assignee
UENDA DAISUKE
JP·3 granted patents·4 pending applications·1 citations·filing 2006–2012
Top patents by PatentIndex Score
7 records- 0160US8841757B2Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor deviceUENDA DAISUKE·Filed 2011·Granted Sep 23, 2014·1 cites·7 claims
- 0250US8475600B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2006·Granted Jul 2, 2013·0 cites·9 claims
- 0348US8524007B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2010·Granted Sep 3, 2013·0 cites·8 claims
- 0440US2012042902A1Cleaning sheet, transfer member with cleaning function, cleaning method of substrate processing apparatus, and substrate processing apparatusUENDA DAISUKE·Filed 2010·Application pending·0 cites
- 0537US2012280706A1Cleaning sheet, cleaning member, cleaning method, and continuity test apparatusUENDA DAISUKE·Filed 2012·Application pending·0 cites
- 0636US2012126379A1Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond filmUENDA DAISUKE·Filed 2011·Application pending·0 cites
- 0736US2012126381A1Adhesive film for semiconductor device, and semiconductor deviceUENDA DAISUKE·Filed 2011·Application pending·0 cites
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