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JP7 patents
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US9185812B2Nov 10, 2015
Lead-free solder paste
UESHIMA MINORU2 citations62
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Lead-free low-temperature solder
UESHIMA MINORU3 citations62
US10354944B2Jul 16, 2019
Method for soldering surface-mount component and surface-mount component
UESHIMA MINORU0 citations51
US8790472B2Jul 29, 2014
Process for producing a solder preform having high-melting metal particles dispersed therein
UESHIMA MINORU0 citations51
US8975757B2Mar 10, 2015
Lead-free solder connection structure and solder ball
UESHIMA MINORU1 citations48
US8865062B2Oct 21, 2014
High-temperature lead-free solder alloy
UESHIMA MINORU1 citations48
US9205513B2Dec 8, 2015
Bi—Sn based high-temperature solder alloy
UESHIMA MINORU0 citations45