Assignee
UNITED MICROELECTRONICS CORP
TW·6,501 granted patents·1,258 pending applications·73,953 citations·filing 1989–2025
Top patents by PatentIndex Score
7,759 records- 0199US11482485B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·7 cites·14 claims
- 0299US9899267B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·81 cites·12 claims
- 0399US9748167B1Silicon interposer, semiconductor package using the same, and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·56 cites·23 claims
- 0499US9478496B1Wafer to wafer structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·48 cites·9 claims
- 0599US8765546B1Method for fabricating fin-shaped field-effect transistorUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 1, 2014·107 cites·14 claims
- 0699US6521547B1Method of repairing a low dielectric constant material layerUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 18, 2003·548 cites·16 claims
- 0799US5627106ATrench method for three dimensional chip connecting during IC fabricationUNITED MICROELECTRONICS CORP·Filed 1994·Granted May 6, 1997·523 cites·33 claims
- 0899US5481133AThree-dimensional multichip packageUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 2, 1996·564 cites·13 claims
- 0999US5380681AThree-dimensional multichip package and methods of fabricatingUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 10, 1995·412 cites·17 claims
- 1098US12089508B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 10, 2024·7 cites·16 claims
- 1198US11901239B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 13, 2024·2 cites·12 claims
- 1298US11706996B2Magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 18, 2023·3 cites·10 claims
- 1398US11062954B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·11 cites·5 claims
- 1498US10840432B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 17, 2020·10 cites·7 claims
- 1598US9899522B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 20, 2018·29 cites·8 claims
- 1698US9735047B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·30 cites·10 claims
- 1798US9728541B1Static random-access memory (SRAM) cell array and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 8, 2017·16 cites·10 claims
- 1898US9530778B1Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·40 cites·11 claims
- 1998US9496361B1Selectively deposited metal gates and method of manufacturing thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 15, 2016·25 cites·20 claims
- 2098US9455227B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·23 cites·7 claims
- 2198US9406521B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·21 cites·10 claims
- 2298US9349833B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 24, 2016·32 cites·11 claims
- 2398US9324570B1Method of manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 26, 2016·29 cites·11 claims
- 2498US9209273B1Method of fabricating metal gate structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 8, 2015·59 cites·20 claims
- 2598US6033951AProcess for fabricating a storage capacitor for semiconductor memory devicesUNITED MICROELECTRONICS CORP·Filed 1996·Granted Mar 7, 2000·240 cites·48 claims
- 2698US5495441ASplit-gate flash memory cellUNITED MICROELECTRONICS CORP·Filed 1994·Granted Feb 27, 1996·207 cites·19 claims
- 2798US5460988AProcess for high density flash EPROM cellUNITED MICROELECTRONICS CORP·Filed 1994·Granted Oct 24, 1995·201 cites·8 claims
- 2898US5414287AProcess for high density split-gate memory cell for flash or EPROMUNITED MICROELECTRONICS CORP·Filed 1994·Granted May 9, 1995·242 cites·21 claims
- 2998US5378649AProcess for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areasUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 3, 1995·337 cites·26 claims
- 3097US11948990B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 2, 2024·3 cites·17 claims
- 3197US11864469B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jan 2, 2024·3 cites·5 claims
- 3297US11818965B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 14, 2023·2 cites·13 claims
- 3397US11774766B2Micro LED layout for augmented reality and mixed reality and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 3, 2023·3 cites·6 claims
- 3497US11765982B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 19, 2023·3 cites·7 claims
- 3597US11749743B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 5, 2023·2 cites·12 claims
- 3697US11735644B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·3 cites·10 claims
- 3797US11721591B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·3 cites·5 claims
- 3897US11581422B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 14, 2023·3 cites·1 claims
- 3997US11557669B2Semiconductor device and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 17, 2023·3 cites·17 claims
- 4097US11527638B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·3 cites·9 claims
- 4197US11296214B2High electron mobility transistor (HEMT) and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 5, 2022·18 cites·12 claims
- 4297US11264492B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 1, 2022·21 cites·2 claims
- 4397US11239327B2HEMT and method of adjusting electron density of 2DEGUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 1, 2022·18 cites·19 claims
- 4497US11205609B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·7 cites·13 claims
- 4597US11205605B2Semiconductor structure with back gate and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·5 cites·12 claims
- 4697US11081579B2High electron mobility transistor and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 3, 2021·19 cites·19 claims
- 4797US10985271B2High electron mobility transistor with improved barrier layerUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·17 cites·11 claims
- 4897US10797157B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 6, 2020·17 cites·16 claims
- 4997US10460980B2Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·17 cites·8 claims
- 5097US10204788B1Method of forming high dielectric constant dielectric layer by atomic layer depositionUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 12, 2019·341 cites·15 claims
Showing the top 50 of 7,759 patent records by PatentIndex Score.
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