Assignee
UNITED MICROELECTRONICS CORP
TW5,000+ patents
Top patents by PatentIndex Score
US6573566B2Jun 3, 2003
Low-voltage-triggered SOI-SCR device and associated ESD protection circuit
UNITED MICROELECTRONICS CORP135 citations99
US6521547B1Feb 18, 2003
Method of repairing a low dielectric constant material layer
UNITED MICROELECTRONICS CORP548 citations99
US6521952B1Feb 18, 2003
Method of forming a silicon controlled rectifier devices in SOI CMOS process for on-chip ESD protection
UNITED MICROELECTRONICS CORP150 citations99
US6303252B1Oct 16, 2001
Reticle having assist feature between semi-dense lines
UNITED MICROELECTRONICS CORP181 citations99
US6274444B1Aug 14, 2001
Method for forming mosfet
UNITED MICROELECTRONICS CORP257 citations99
US6252300B1Jun 26, 2001
Direct contact through hole type wafer structure
UNITED MICROELECTRONICS CORP128 citations99
US6239367B1May 29, 2001
Multi-chip chip scale package
UNITED MICROELECTRONICS CORP243 citations99
US6203863B1Mar 20, 2001
Method of gap filling
UNITED MICROELECTRONICS CORP318 citations99
US6033951AMar 7, 2000
Process for fabricating a storage capacitor for semiconductor memory devices
UNITED MICROELECTRONICS CORP240 citations99
US6028342AFeb 22, 2000
ROM diode and a method of making the same
UNITED MICROELECTRONICS CORP152 citations99
US5994745ANov 30, 1999
ROM device having shaped gate electrodes and corresponding code implants
UNITED MICROELECTRONICS CORP124 citations99
US5946558AAug 31, 1999
Method of making ROM components
UNITED MICROELECTRONICS CORP201 citations99
US5858841AJan 12, 1999
ROM device having memory units arranged in three dimensions, and a method of making the same
UNITED MICROELECTRONICS CORP149 citations99
US5811283ASep 22, 1998
Silicon on insulator (SOI) dram cell structure and process
UNITED MICROELECTRONICS CORP178 citations99
US5801094ASep 1, 1998
Dual damascene process
UNITED MICROELECTRONICS CORP178 citations99
US5798298AAug 25, 1998
Method of automatically generating dummy metals for multilevel interconnection
UNITED MICROELECTRONICS CORP177 citations99
US5792697AAug 11, 1998
Method for fabricating a multi-stage ROM
UNITED MICROELECTRONICS CORP153 citations99
US5769719AJun 23, 1998
Video game system having means for displaying a key programming
UNITED MICROELECTRONICS CORP194 citations99
US5627106AMay 6, 1997
Trench method for three dimensional chip connecting during IC fabrication
UNITED MICROELECTRONICS CORP523 citations99
US5495441AFeb 27, 1996
Split-gate flash memory cell
UNITED MICROELECTRONICS CORP207 citations99
US5481133AJan 2, 1996
Three-dimensional multichip package
UNITED MICROELECTRONICS CORP564 citations99
US5460988AOct 24, 1995
Process for high density flash EPROM cell
UNITED MICROELECTRONICS CORP201 citations99
US5442214AAug 15, 1995
VDMOS transistor and manufacturing method therefor
UNITED MICROELECTRONICS CORP174 citations99
US5424231AJun 13, 1995
Method for manufacturing a VDMOS transistor
UNITED MICROELECTRONICS CORP171 citations99
US5414287AMay 9, 1995
Process for high density split-gate memory cell for flash or EPROM
UNITED MICROELECTRONICS CORP242 citations99
US5380681AJan 10, 1995
Three-dimensional multichip package and methods of fabricating
UNITED MICROELECTRONICS CORP412 citations99
US5378647AJan 3, 1995
Method of making a bottom gate mask ROM device
UNITED MICROELECTRONICS CORP147 citations99
US10204788B1Feb 12, 2019
Method of forming high dielectric constant dielectric layer by atomic layer deposition
UNITED MICROELECTRONICS CORP341 citations98
US9899267B1Feb 20, 2018
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP81 citations98
US9748167B1Aug 29, 2017
Silicon interposer, semiconductor package using the same, and fabrication method thereof
UNITED MICROELECTRONICS CORP56 citations98
US9478496B1Oct 25, 2016
Wafer to wafer structure and method of fabricating the same
UNITED MICROELECTRONICS CORP48 citations98
US8765546B1Jul 1, 2014
Method for fabricating fin-shaped field-effect transistor
UNITED MICROELECTRONICS CORP107 citations98
US7449407B2Nov 11, 2008
Air gap for dual damascene applications
UNITED MICROELECTRONICS CORP59 citations98
US7253095B2Aug 7, 2007
Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
UNITED MICROELECTRONICS CORP59 citations98
US7138329B2Nov 21, 2006
Air gap for tungsten/aluminum plug applications
UNITED MICROELECTRONICS CORP74 citations98
US6888181B1May 3, 2005
Triple gate device having strained-silicon channel
UNITED MICROELECTRONICS CORP117 citations98
US6855588B1Feb 15, 2005
Method of fabricating a double gate MOSFET device
UNITED MICROELECTRONICS CORP92 citations98
US6720267B1Apr 13, 2004
Method for forming a cantilever beam model micro-electromechanical system
UNITED MICROELECTRONICS CORP124 citations98
US6552320B1Apr 22, 2003
Image sensor structure
UNITED MICROELECTRONICS CORP92 citations98
US6465768B1Oct 15, 2002
MOS structure with improved substrate-triggered effect for on-chip ESD protection
UNITED MICROELECTRONICS CORP92 citations98
US6461956B1Oct 8, 2002
Method of forming package
UNITED MICROELECTRONICS CORP107 citations98
US6410373B1Jun 25, 2002
Method of forming polysilicon thin film transistor structure
UNITED MICROELECTRONICS CORP91 citations98
US6392930B2May 21, 2002
Method of manufacturing mask read-only memory cell
UNITED MICROELECTRONICS CORP140 citations98
US6368941B1Apr 9, 2002
Fabrication of a shallow trench isolation by plasma oxidation
UNITED MICROELECTRONICS CORP170 citations98
US6368923B1Apr 9, 2002
Method of fabricating a dual metal gate having two different gate dielectric layers
UNITED MICROELECTRONICS CORP118 citations98
US6323546B2Nov 27, 2001
Direct contact through hole type wafer structure
UNITED MICROELECTRONICS CORP83 citations98
US6319807B1Nov 20, 2001
Method for forming a semiconductor device by using reverse-offset spacer process
UNITED MICROELECTRONICS CORP95 citations98
US6294834B1Sep 25, 2001
Structure of combined passive elements and logic circuit on a silicon on insulator wafer
UNITED MICROELECTRONICS CORP117 citations98
US6249022B1Jun 19, 2001
Trench flash memory with nitride spacers for electron trapping
UNITED MICROELECTRONICS CORP116 citations98
US6239366B1May 29, 2001
Face-to-face multi-chip package
UNITED MICROELECTRONICS CORP124 citations98
Showing the top 50 of 5,000+ patents by PatentIndex Score.