Assignee
UNITIVE ELECTRONICS INC
US5 patents
Top patents by PatentIndex Score
US6492197B1Dec 10, 2002
Trilayer/bilayer solder bumps and fabrication methods therefor
UNITIVE ELECTRONICS INC128 citations98
US6418033B1Jul 9, 2002
Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
UNITIVE ELECTRONICS INC61 citations96
US7081404B2Jul 25, 2006
Methods of selectively bumping integrated circuit substrates and related structures
UNITIVE ELECTRONICS INC56 citations92
US6666368B2Dec 23, 2003
Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween
UNITIVE ELECTRONICS INC17 citations84
US7032806B2Apr 25, 2006
Methods of positioning components using liquid prime movers and related structures
UNITIVE ELECTRONICS INC10 citations74