Assignee
UNO TAKEO
JP·1 granted patent·1 pending application·0 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0145US8674229B2Ultra-thin copper foil with carrier and copper-clad laminate board or printed circuit board substrateUNO TAKEO·Filed 2009·Granted Mar 18, 2014·0 cites·15 claims
- 0235US2012285734A1Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit boardUNO TAKEO·Filed 2011·Application pending·0 cites
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