Assignee
UNO TOMOHIRO
JP·11 granted patents·137 citations·filing 2007–2012
Top patents by PatentIndex Score
11 records- 0197US8653668B2Copper bonding wire for semiconductor device and bonding structure thereofUNO TOMOHIRO·Filed 2011·Granted Feb 18, 2014·51 cites·14 claims
- 0296US8836147B2Bonding structure of multilayer copper bonding wireUNO TOMOHIRO·Filed 2011·Granted Sep 16, 2014·44 cites·29 claims
- 0391US8389860B2Bonding wire for semiconductor devicesUNO TOMOHIRO·Filed 2008·Granted Mar 5, 2013·21 cites·13 claims
- 0476US8102061B2Semiconductor device bonding wire and wire bonding methodUNO TOMOHIRO·Filed 2008·Granted Jan 24, 2012·6 cites·10 claims
- 0570US8299356B2Bonding wire for semiconductor devicesUNO TOMOHIRO·Filed 2008·Granted Oct 30, 2012·4 cites·26 claims
- 0669US8610291B2Copper alloy bonding wire for semiconductor deviceUNO TOMOHIRO·Filed 2007·Granted Dec 17, 2013·3 cites·13 claims
- 0768US8247911B2Wire bonding structure and method for forming sameUNO TOMOHIRO·Filed 2008·Granted Aug 21, 2012·4 cites·26 claims
- 0861US9427830B2Copper alloy bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 30, 2016·1 cites·8 claims
- 0961US9331049B2Bonding structure of bonding wireUNO TOMOHIRO·Filed 2009·Granted May 3, 2016·2 cites·15 claims
- 1061US8815019B2Bonding wire for semiconductorUNO TOMOHIRO·Filed 2010·Granted Aug 26, 2014·1 cites·21 claims
- 1150US9112059B2Bonding wire for semiconductor deviceUNO TOMOHIRO·Filed 2012·Granted Aug 18, 2015·0 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when UNO TOMOHIRO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →