Assignee
URAKAWA YUKIHIRO
JP·4 granted patents·1 pending application·31 citations·filing 2006–2012
Top patents by PatentIndex Score
5 records- 0187US8208325B2Semiconductor device, semiconductor package and memory repair methodURAKAWA YUKIHIRO·Filed 2010·Granted Jun 26, 2012·12 cites·20 claims
- 0283US8237289B2System in package deviceURAKAWA YUKIHIRO·Filed 2008·Granted Aug 7, 2012·12 cites·13 claims
- 0378US8232622B2Stacked-chip deviceURAKAWA YUKIHIRO·Filed 2009·Granted Jul 31, 2012·7 cites·8 claims
- 0448US8338964B2Stacked-chip deviceURAKAWA YUKIHIRO·Filed 2012·Granted Dec 25, 2012·0 cites·10 claims
- 0541US2006248383A1Processing device on which processing elements having same function are embedded in one chipURAKAWA YUKIHIRO·Filed 2006·Application pending·0 cites
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