Assignee
UTAC HONG KONG LTD
CN·4 granted patents·27 citations·filing 2009–2014
Top patents by PatentIndex Score
4 records- 0188US7858443B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2009·Granted Dec 28, 2010·19 cites·9 claims
- 0273US9305889B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 0372US9449903B2Ball grid array package with improved thermal characteristicsUTAC HONG KONG LTD·Filed 2013·Granted Sep 20, 2016·3 cites·7 claims
- 0466US8828801B2Leadless array plastic package with various IC packaging configurationsUTAC HONG KONG LTD·Filed 2013·Granted Sep 9, 2014·2 cites·20 claims
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