Assignee
VAL CHRISTIAN
FR7 patents
Top patents by PatentIndex Score
US8567051B2Oct 29, 2013
Process for the vertical interconnection of 3D electronic modules by vias
VAL CHRISTIAN28 citations92
US8735220B2May 27, 2014
Method for positioning chips during the production of a reconstituted wafer
VAL CHRISTIAN4 citations72
US8546190B2Oct 1, 2013
Method for positioning chips during the production of a reconstituted wafer
VAL CHRISTIAN4 citations62
US8243468B2Aug 14, 2012
Low-thickness electronic module comprising a stack of electronic packages provided with connection balls
VAL CHRISTIAN2 citations62
US8136237B2Mar 20, 2012
Method of interconnecting electronic wafers
VAL CHRISTIAN4 citations62
US9111688B2Aug 18, 2015
Method for producing reconstituted wafers with support of the chips during their encapsulation
VAL CHRISTIAN1 citations51
US8264853B2Sep 11, 2012
3D electronic module
VAL CHRISTIAN0 citations39