Assignee
WADA YOSHIYUKI
JP·2 granted patents·5 pending applications·5 citations·filing 2005–2011
Top patents by PatentIndex Score
7 records- 0166US8418358B2Wiring board with built-in component and method for manufacturing wiring board with built-in componentWADA YOSHIYUKI·Filed 2008·Granted Apr 16, 2013·5 cites·10 claims
- 0249US8499998B2Component built-in circuit substrate and method of producing the sameWADA YOSHIYUKI·Filed 2009·Granted Aug 6, 2013·0 cites·7 claims
- 0346US2008260025A1Coding rate converting apparatus, integrated circuit, and method, and program for the sameWADA YOSHIYUKI·Filed 2008·Application pending·0 cites
- 0441US2006043597A1Solder composition, connecting process with soldering, and connection structure with solderingWADA YOSHIYUKI·Filed 2005·Application pending·0 cites
- 0541US2006043543A1Solder composition, connecting process with soldering, and connection structure with solderingWADA YOSHIYUKI·Filed 2005·Application pending·0 cites
- 0638US2007221711A1Method of Packaging Electronic ComponentWADA YOSHIYUKI·Filed 2005·Application pending·0 cites
- 0733US2012309133A1Electronic component mounting methodWADA YOSHIYUKI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when WADA YOSHIYUKI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →