Assignee
WAI YONG LAM
MY·3 granted patents·19 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0186US8314479B2Leadframe package with recessed cavity for LEDWAI YONG LAM·Filed 2011·Granted Nov 20, 2012·10 cites·19 claims
- 0283US8394675B2Manufacturing light emitting diode (LED) packagesWAI YONG LAM·Filed 2011·Granted Mar 12, 2013·8 cites·14 claims
- 0356US8535988B2Large panel leadframeWAI YONG LAM·Filed 2012·Granted Sep 17, 2013·1 cites·20 claims
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