Assignee
WALSIN ADVANCED ELECTRONICS
US15 patents
Top patents by PatentIndex Score
US6459148B1Oct 1, 2002
QFN semiconductor package
WALSIN ADVANCED ELECTRONICS214 citations95
US6337510B1Jan 8, 2002
Stackable QFN semiconductor package
WALSIN ADVANCED ELECTRONICS353 citations95
US6437429B1Aug 20, 2002
Semiconductor package with metal pads
WALSIN ADVANCED ELECTRONICS257 citations93
US6762118B2Jul 13, 2004
Package having array of metal pegs linked by printed circuit lines
WALSIN ADVANCED ELECTRONICS32 citations92
US6278182B1Aug 21, 2001
Lead frame type semiconductor package
WALSIN ADVANCED ELECTRONICS40 citations92
US6380624B1Apr 30, 2002
Stacked integrated circuit structure
WALSIN ADVANCED ELECTRONICS36 citations91
US6385049B1May 7, 2002
Multi-board BGA package
WALSIN ADVANCED ELECTRONICS107 citations90
US6078099AJun 20, 2000
Lead frame structure for preventing the warping of semiconductor package body
WALSIN ADVANCED ELECTRONICS24 citations90
US6521485B2Feb 18, 2003
Method for manufacturing wafer level chip size package
WALSIN ADVANCED ELECTRONICS50 citations87
US6204553B1Mar 20, 2001
Lead frame structure
WALSIN ADVANCED ELECTRONICS40 citations87
US6380062B1Apr 30, 2002
Method of fabricating semiconductor package having metal peg leads and connected by trace lines
WALSIN ADVANCED ELECTRONICS16 citations83
US6262475B1Jul 17, 2001
Lead frame with heat slug
WALSIN ADVANCED ELECTRONICS11 citations73
US6650005B2Nov 18, 2003
Micro BGA package
WALSIN ADVANCED ELECTRONICS10 citations72
US6486564B2Nov 26, 2002
Heat dissipation module for a BGA IC
WALSIN ADVANCED ELECTRONICS7 citations70
US6459162B1Oct 1, 2002
Encapsulated semiconductor die package
WALSIN ADVANCED ELECTRONICS3 citations56