Assignee
WANG HSIAO-LEI
TW·2 granted patents·5 pending applications·0 citations·filing 2009–2024
Top patents by PatentIndex Score
7 records- 0166US2024429347A1RGB FULL-COLOR InGaN-BASED LED AND METHOD FOR PREPARING THE SAMEWANG HSIAO LEI·Filed 2024·Application pending·0 cites
- 0250US12295185B2Epitaxial substrate having a 2D material interposer, method for manufacturing the epitaxial substrate, and device prepared from the epitaxial substrateWANG HSIAO LEI·Filed 2022·Granted May 6, 2025·0 cites·10 claims
- 0348US2022149238A1RGB FULL-COLOR InGaN-BASED LED AND METHOD FOR PREPARING THE SAMEWANG HSIAO LEI·Filed 2020·Application pending·0 cites
- 0442US2025234683A1Manufacturing method for rgb ingan-based micro led, and device manufactured therebyWANG HSIAO LEI·Filed 2022·Application pending·0 cites
- 0540US2011084325A1Dram structure with a low parasitic capacitance and method of making the sameWANG HSIAO-LEI·Filed 2009·Application pending·0 cites
- 0639US2023046307A1Epitaxial substrate with 2d material interposer, manufacturing method, and manufacturing assemblyWANG HSIAO LEI·Filed 2020·Application pending·0 cites
- 0729US10297446B2Encapsulated substrate, manufacturing method, high band-gap device having encapsulated substrateWANG HSIAO LEI·Filed 2018·Granted May 21, 2019·0 cites·16 claims
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