Assignee
WEI BIN
US·7 granted patents·59 citations·filing 2008–2020
Top patents by PatentIndex Score
7 records- 0196US8535491B2Electrochemical machining assembly with curved electrodeWEI BIN·Filed 2009·Granted Sep 17, 2013·15 cites·18 claims
- 0291US8857055B2Process and system for forming shaped air holesWEI BIN·Filed 2010·Granted Oct 14, 2014·15 cites·11 claims
- 0390US8200779B2Method for creating and providing layered syndicated data for multimedia content to usersWEI BIN·Filed 2010·Granted Jun 12, 2012·11 cites·17 claims
- 0489USD920031SHerb grinderWEI BIN·Filed 2020·Granted May 25, 2021·13 cites·1 claims
- 0584US8778147B2Method and tool for forming non-circular holes using a selectively coated electrodeWEI BIN·Filed 2008·Granted Jul 15, 2014·5 cites·7 claims
- 0654US8566421B2Method for creating and providing layered syndicated data for multimedia content to usersWEI BIN·Filed 2012·Granted Oct 22, 2013·0 cites·20 claims
- 0748US8900424B2Electrode and electrochemical machining process for forming non-circular holesWEI BIN·Filed 2012·Granted Dec 2, 2014·0 cites·10 claims
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