Assignee
WEN YING-NAN
TW·3 granted patents·3 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0169US8564133B2Chip package and method for forming the sameWEN YING-NAN·Filed 2010·Granted Oct 22, 2013·3 cites·22 claims
- 0243US8692284B2Interposer and manufacturing method thereofWEN YING-NAN·Filed 2012·Granted Apr 8, 2014·0 cites·19 claims
- 0338US8614488B2Chip package and method for forming the sameWEN YING-NAN·Filed 2011·Granted Dec 24, 2013·0 cites·20 claims
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