Assignee
WIRE TECH CO LTD
TW·2 granted patents·2 pending applications·2 citations·filing 2013–2017
Top patents by PatentIndex Score
4 records- 0161US9425168B2Stud bump and package structure thereof and method of manufacturing the sameWIRE TECH CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·11 claims
- 0242US9490147B2Stud bump structure and method for manufacturing the sameWIRE TECH CO LTD·Filed 2013·Granted Nov 8, 2016·0 cites·13 claims
- 0320US2017103823A1Graphene coated silver alloy wire and methods for manufacturing the sameWIRE TECH CO LTD·Filed 2016·Application pending·0 cites
- 0420US2018076167A1Metallic ribbon for power module packagingWIRE TECH CO LTD·Filed 2017·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →