Assignee
WONG WAI KEONG
MY·4 granted patents·1 pending application·11 citations·filing 2011–2014
Top patents by PatentIndex Score
5 records- 0180US8643159B2Lead frame with grooved lead fingerWONG WAI KEONG·Filed 2012·Granted Feb 4, 2014·7 cites·11 claims
- 0265US9099363B1Substrate with corner cut-outs and semiconductor device assembled therewithWONG WAI KEONG·Filed 2014·Granted Aug 4, 2015·4 cites·19 claims
- 0348US9006874B2Lead frame with grooved lead fingerWONG WAI KEONG·Filed 2014·Granted Apr 14, 2015·0 cites·6 claims
- 0441US9293395B2Lead frame with mold lock structureWONG WAI KEONG·Filed 2014·Granted Mar 22, 2016·0 cites·6 claims
- 0536US2012318853A1Heater block for wire bonding systemWONG WAI KEONG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →