Assignee

WOO DO CHOUL

KR·1 granted patent·0 citations·filing 2007–2007

Technology mixB29C1 B29L1 C08L1 H01L1 H10H1 H10W1

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0130US8981399B2Method of fabricating light emitting diode package with surface treated resin encapsulant and the package fabricated by the methodWOO DO CHOUL·Filed 2007·Granted Mar 17, 2015·0 cites·11 claims

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